1. The ball supply system is equipped with a micro-pressure difference detection function, which realizes automatic ball distribution, automatic detection, and fast and stable supply of various sizes of solder balls;
2. The fiber laser is used to realize rapid soldering of solder balls. The diameter of the ball is suitable for matching the power laser;
3. The CCD positioning system realizes the precise positioning of the welding position through automatic image recognition;
4. The motion system uses linear motors and servo motors as the moving elements, with fast movement speed and high stability;
5. It has the function of automatic cleaning of the welding tip and automatic inspection of the appearance of the welding tip to ensure the welding quality;
6. The automatic laser centering function of the welding tip can be selected to realize the rapid replacement and calibration of the welding tip;
7. Dual-channel, parallel CCD positioning and welding mechanism , improve welding efficiency;
8. PC control system with independent intellectual property rights, to achieve precise control of the whole machine;
1. The tin balls are melted by laser, and the melted tin balls are sprayed onto the welding parts to achieve precise welding, thereby ensuring the reliable electrical continuity and welding strength of the components;
2. Non-contact welding, no flux welding, no cleaning;
1. Flux-free soldering, no cleaning, cost saving;
2. Solder ball soldering, stable tin amount of solder joints, good appearance consistency, improve soldering quality;
3. Realize precise soldering of tiny soldering positions, solving the problem of manual inability to solder ;
4. High welding speed, increase productivity and save labor costs;
The product is suitable for BGA, VCM, CCM, HDD
| Basic Parameters | Dimensions (mm) | 1310(L)*1150(W)*1800(H) mm |
| Equipment weight | 1600kg |
| Operating voltage | 220VAC, 50/60Hz |
| Normal power | 16KW |
| Working air pressure | 0.4~0.6 Mpa |
| Working nitrogen pressure | 0.2~0.4 Mpa |
| Function Parameter | Applicable solder ball diameter specification (um) | 70-1000 |
| Welding speed (ball/sec) | 4~8 |
| Applicable welding spacing | 0.1mm minimum |
| Mean time between failures (MTBF) | 4H |
| Equipment one-time optimization rate | ≥99.5% |
| Repeatability | ≤0.003mm |
| Welding accuracy | ±0.01mm |
| Environmental Parameters | Noise | <70dB |
| Temperature | 10~40℃ |
| Humidity | 40~70% |
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